Das ist der Job
Our platform enables advanced packaging by combining patterning and metallisation into a single tool.
Darum lohnt es sich
Founded in Australia, we are building a world‑class team tackling some of the toughest challenges in semiconductor manufacturing. About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology.
We achieve high‑speed, high‑resolution metallisation at significantly lower cost and energy use, while minimizing emissions and waste. Our collaborative, people‑first culture empowers individuals to take ownership, move quickly, and deliver meaningful impact.
About the Role
This role is a critical addition to our technical capabilities, enabling in‑house design of advanced substrate IC packages and multi‑layered interposers. You'll play a foundational role in developing designs that underpin next‑generation packaging architectures, including high‑performance chip‑to‑chip integration approaches.
Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform.
This highly technical, hands‑on role has immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology. Responsibilities Design large (>50 mm) complex multi‑layer substrate interposers with high pi
